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PAP Technology Developed by JTEC Corporation

PAP(Plasma Assisted Polishing )

This technology utilizes plasma to activate and polish surfaces, specifically designed for polishing hard materials such as diamond. Compared to conventional mechanical polishing using diamond abrasives, it offers higher efficiency while preventing the formation of processing-induced damage layers. This technology is gaining significant attention for its potential in the polishing process of diamond substrates, which are expected to play a crucial role in next-generation power devices.

PAP(Plasma Assisted Polishing )
High-efficiency polishing with plasma assistance without damaging the substrate.

Strengths of PAP Technology

POINT

High-efficiency, high-precision polishing

Achieves both high processing speed and precision at an advanced level

POINT

No processing-induced alteration layer

Preserves crystal structure integrity and prevents surface damage, enhancing product reliability and performance

POINT

Environmentally conscious

A fully dry process that does not use chemicals or polishing slurry, contributing to reduced environmental impact.

Advantages

The PAP (Plasma Assisted Polishing) Equipment is designed to achieve high-efficiency and damage-free polishing by utilizing plasma-activated particles (ions and radicals) that chemically bond with the atoms on the surface of the workpiece, weakening the interatomic bonds. This enables high-precision processing of ultra-hard materials such as diamond, which has been challenging with conventional mechanical polishing methods.

Wide Applicability

Applicable to hard materials and new materials beyond diamond, providing equipment for a wide range of phases from research and development to mass production.

Shortened Polishing Time

Reduced Polishing Time for Improved Efficiency

Cost Reduction

By adopting a simple design, equipment costs are reduced, and slurry-free operation lowers running costs.

Application Examples

Devices made from hard materials such as diamond and silicon carbide (SiC) exhibit excellent thermal efficiency due to their high thermal conductivity and low thermal expansion coefficient, allowing them to operate at high temperatures without losing efficiency. As a result, heat dissipation design becomes simpler, and durability and reliability at high temperatures are enhanced. This technology is expected to be increasingly utilized in various fields, including semiconductors, electronics, aerospace, medical devices, renewable energy, laser technology, and transportation sectors such as automobiles and trains.

Application to Hard-to-Process Wafers
(e.g., Diamond)

Application to Power Devices: Contributing to the performance enhancement of next-generation power devices by applying to high-quality SiC wafers and diamond substrates.
Application to Optical Components: Suitable for manufacturing high-precision diamond lenses and windows.

Application to Diamond Heat Dissipation Substrates

Application to Heat Sinks: Diamond substrate heat sinks are attracting attention as highly effective cooling solutions due to their excellent thermal conductivity and high durability.

Application to Mechanical Uses of Diamond

Application to Mechanical Uses: Diamond, with its excellent wear resistance and anti-adhesion properties, is gaining attention for use in tools, molds, and sliding components. Additionally, improved machining precision and defect reduction are expected to lower costs and extend product lifespan

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Technology Application Examples

Power Devices

Diamond substrates contribute to improving the efficiency and reliability of power devices due to their high thermal conductivity and pressure resistance. Additionally, the exceptional properties of diamond enable stable performance even in harsh operating environments.

Despite their advantages, diamond substrates face challenges for practical application, including cost, machining difficulty, bonding technology, and thermal expansion issues. However, in terms of machining difficulty, PAP (Plasma Assisted Polishing) has achieved clean, high-efficiency polishing without generating a processing-induced altered layer.

Application

・Power Electronics: Power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), IGBT (Insulated Gate Bipolar Transistor)
・Power Conversion Devices: Power conversion devices for solar power generation systems and wind power generation systems.
・Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV): Inverters and power control units for electric and hybrid vehicles
・High-Frequency and High-Power Communication Equipment: High-frequency communication devices and high-power communication systems (such as radar systems and satellite communication devices)
・High-Power Laser Systems: High-power laser equipment and laser-guided systems

Heat Sink

Heat sinks made of aluminum or copper substrates have been commonly used. However, in electronic devices with high thermal loads, as well as in specialized applications, cooling systems tend to become complex and large-scale. On the other hand, using diamond heat sinks provides a simple and efficient solution.

Despite its superior properties, the use of diamond has been limited due to its high cost and machining difficulties. However, PAP (Plasma Assisted Polishing) has enabled clean, high-efficiency polishing without inducing processing-induced damage layers. This technology expands the potential for the practical application of diamond substrate heat sinks.

Application

・High-Performance Electronic Devices: High-performance semiconductor devices and integrated circuits (ICs)
・Laser Equipment: High-power laser systems and laser diodes
・High-Power Electrical Equipment: Power electronics (such as high-power transistors and power MOSFETs)
・Aerospace and Satellite Technology
・Medical Equipment: Medical devices requiring precise cooling (such as MRI and CT scanners)

Processing Overview

PAP Processing Overview

*e.g.,Diamond substrates

Plasma-Induced Surface Modification

The reason why even hard materials can be processed is that the plasma on the processing table chemically bonds strongly with the atoms on the surface of the workpiece (such as a diamond substrate), thereby breaking the bonds between the surface and the internal structure of the workpiece.

Polishing Process

Since this is a dry process that does not use diamond slurry or polishing plates typically used for hard materials, it creates a smooth surface without defects or processing-induced damage.

The surface roughness of single-crystal diamond substrates is significantly improved

The surface roughness of single-crystal diamond substrates is significantly improved.

By applying PAP (Plasma Assisted Polishing), the surface roughness (Sa value) of diamond substrates is greatly improved from 61.8 nm to 0.31 nm.

Measurement by Atomic Force Microscopy (AFM)

The root mean square roughness after polishing was measured at 0.36 nm, confirming an extremely smooth surface.

Measurement by Atomic Force Microscope (AFM)

Measurement by Confocal Raman Microscopy

Confirmed no disruption in crystallinity or transition to a graphite structure, achieving damage-free polishing.

Confocal Raman Microscope gruf

Comparison with Conventional Polishing Methods and Their Advantages

  Issues

Advantages of

PAP (Plasma Assisted Polishing)
Comparison with Mechanical Polishing Methods

The mechanical polishing method is a polishing method that physically removes material using hard abrasives such as diamond grit.

[Low Polishing Efficiency]
Polishing hard materials takes time, resulting in low productivity.

[Surface Damage Occurrence]
During polishing, small surface damages and defects are likely to occur.

[High-Efficiency Polishing]
By applying surface modification through plasma, high-speed polishing of hard materials is possible.

[Damage-Free Polishing]
Minimizes surface damage, improving the quality of the product.
Comparison with Chemical Mechanical Polishing (CMP) Method

CMP is a method that combines chemical etching and mechanical polishing, mainly used for planarizing semiconductor wafers.

[Environmental Impact]
Since a large amount of chemicals is used, concerns arise regarding wastewater treatment and environmental impact.

[Difficulty in Application to Hard Materials]
The effectiveness is limited for ultra-hard materials such as diamond.

[Environmentally Friendly]
Only plasma is used, with no chemical usage at all.

[Specialized for Hard Materials]
High-precision polishing is possible for materials such as diamond, which are difficult to process with CMP.
Comparison with Scaife Polishing Method

The Scaife polishing method is a conventional polishing technology that has been used for high-precision polishing of diamonds.

[Limitations of Polishing Speed]
Focusing on machining accuracy tends to result in slower polishing speeds.

[Polishing Cost]
Since polishing requires a significant amount of time, the cost becomes high.

[Achieving Both High Speed and High Precision]
Improves polishing speed while maintaining accuracy equal to or greater than that of Scaife polishing.

[Efficiency and Cost Improvement]
Reduces overall costs by shortening polishing time and eliminating slurry usage.
Comparison with Ion Beam Polishing Method

The ion beam polishing method is a polishing method that removes material by irradiating the material surface with an ion beam.

[High Equipment Cost]
Advanced vacuum equipment and ion sources are required, leading to high initial investment.

[Slow Polishing Speed]
The removal rate is low, making it unsuitable for large-area polishing or mass production.

[Cost-Effective Equipment]
PAP equipment is more cost-effective compared to ion beam equipment.

[High Polishing Speed]
By combining plasma and mechanical polishing, efficient polishing is possible.
Comparison with Laser Processing Method

The laser processing method is a processing method that uses a high-power laser to evaporate or sublimate materials.

[Thermal Effects]
High temperatures may cause thermal deformation or internal stresses in the material.

[Surface Quality Limitations]
Microcracks or re-solidification layers may occur.

[Low Thermal Impact]
Plasma surface modification is performed at low temperatures, minimizing material degradation due to heat.

[High-Quality Surface]
Damage-free polishing significantly improves surface quality.

Product Features

PAP (Plasma Assisted Polishing) offers a significant advantage over competing polishing methods by enabling highly efficient, damage-free polishing of hard materials. This provides the following benefits:

・Improved Product Quality: High-quality surface finishing enhances the product’s performance and reliability.
・Improved Productivity: Faster polishing speeds improve production efficiency.
・Cost Reduction: Shorter polishing time and reduced environmental impact lead to overall cost savings.
・Environmental Compliance: No chemicals are used, ensuring compliance with environmental regulations and enhancing the company’s image.

Steps to Equipment Installation

STEP

Inquiry

Accepting inquiries about PAP (Plasma Assisted Polishing) technology and equipment.

STEP

Technology Introduction

Visit or Web meeting based on your preference.

STEP

Sample Polishing and Evaluation

Test polishing and evaluation cycles are conducted as needed.

STEP

Proposal for Estimated Cost and Equipment Specifications

Proposal based on needs and test polishing results.

Proposing the optimal system tailored to your needs.

If you have any inquiries or need more detailed information, please feel free to contact JTEC Corporation.

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Example of Main Unit Configuration

Example Configuration of PAP (Plasma Assisted Polishing) System

Equipment Specifications

PAP(Plasma Assisted Polishing Method) PA1100
Basic Specifications Worktable Material Quartz, etc. (Diameter: 240 mm)
Workpiece Size Flat: Maximum diameter 4 inches, Thickness: 0.4 mm – 20 mm
Plasma Power Supply Maximum 1 kW
Process Gas Ar、 O2
Vacuum Level (During Processing) Ultimate vacuum: 20 Pa
Control Unit Programmable Logic Controller (PLC)
External Dimensions W1400 mm × D800 mm × H1900 mm
Mass Approx. 400 kg
Utilities Power Supply Three-phase AC 200V, 20A / Single-phase AC 100V, 15A
Instrument Air 0.4～0.6MPa

※For workpiece size, please consult us.

Company Profile

Company Name [Trade Name] JTEC Corporation
President and Representative Director Takashi Tsumura
Description of Business Design, manufacture and sales of X-ray mirrors for synchrotron radiation facilities
Development, design, manufacture and sales of automated cell culture system
Development, design, manufacture, and sales of various automated systems
Development, manufacturing, and sales of surface processing of various materials
Support services related to regenerative medicine
Capital stock 837,948,000 yen (as of June 30, 2024: consolidated)
Established 1993/12/21
Location of head office 2-5-38, Saito Yamabuki, Ibaraki, Osaka 567-0086, Japan
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