{"id":5230,"date":"2025-10-22T12:22:48","date_gmt":"2025-10-22T03:22:48","guid":{"rendered":"https:\/\/jteccorp.wdkb.jp\/?page_id=5230"},"modified":"2026-06-22T15:06:33","modified_gmt":"2026-06-22T06:06:33","slug":"care","status":"publish","type":"page","link":"https:\/\/www.j-tec.co.jp\/english\/device\/care\/","title":{"rendered":"CARE\uff08CAtalyst Referred Etching\uff09"},"content":{"rendered":"\n<div class=\"l-detail-content\">\n    <h1 class=\"c-title content-head -bd\"> CAtalyst-Referenced Etching (CARE)<br><span class=\"en-title\">Optimal Solution for Atomic-Level Smoothness in Next-Generation Semiconductors and Ceramics<\/span>\n<\/h1>\n    <div class=\"c-section\">\n        <div class=\"c-text\">\n            <p>CARE (CAtalyst Referred Etching) is a high-precision, atom-level machining process that utilizes metal catalysis and relies solely on pure water, achieving a surface roughness (RMS) of less than 0.1 nm. It is typically employed as the final finishing step following surface processes such as CMP (Chemical Mechanical Polishing). In SAW (Surface Acoustic Wave) devices fabricated using LN\uff08Lithium Niobate\uff09\/ LT\uff08Lithium Tantalate\uff09 wafers, CARE significantly enhances device performance. Furthermore, applying CARE to the substrates of bonded devices improves bonding reliability. This is one of our core nanomachining technologies used to realize our high-precision X-ray mirrors.As a precision polishing service Japan provider with expertise in compound semiconductor polishing, we welcome inquiries on CARE applications.<\/p>\n        <\/div>\n        <div class=\"kakoubox\">\n            <dl>\n                <dt>Workpiece<\/dt>\n                <dd>SiO<sub>2<\/sub>, Si, LN\uff08Lithium Niobate\uff09, LT\uff08Lithium Tantalate\uff09, etc.<\/dd>\n            <\/dl>\n            <dl>\n                <dt>Application Examples<\/dt>\n                <dd>\n                    <ul class=\"c-list\">\n                        <li>Surface finish of LN substrate for SAW devices (Sa &lt; 0.1 nm)<\/li>\n                        <li>Surface finish of wafer and bonding (Si, SiO<sub>2<\/sub>, etc.) surfaces<\/li>\n                        <li>Improvement of junction reliability through cleanliness<\/li>\n                    <\/ul>\n                <\/dd>\n            <\/dl>\n        <\/div>\n    <\/div>\n    <div class=\"c-section\">\n        <div class=\"c-col2 -half u-mb30\">\n            <div class=\"c-col\">\n                <div class=\"c-text\">\n                    <h2 class=\"c-title l2\">CA1000<\/h2>\n                    <div class=\"c-image u-text-center\">\n                        <img src=\"\/assets\/img\/device\/care\/ca100.webp\" alt=\"Catalyst Referred Etching System CA1000\" loading=\"lazy\">\n                    <\/div>\n                <\/div>\n            <\/div>\n            <div class=\"c-col\">\n                <div class=\"c-text\">\n                    <h2 class=\"c-title l2\">Processing stage unit of the CA1000<\/h2>\n                    <div class=\"c-image\">\n                        <img src=\"\/assets\/img\/device\/care\/fig2.jpg\" class=\"\" alt=\"CARE Processing Section\" loading=\"lazy\">\n                    <\/div>\n                <\/div>\n            <\/div>\n        <\/div>\n        <div class=\"c-text\">\n            <h2 class=\"c-title l2\">Video<\/h2>\n            <div class=\"c-video col1\">\n                <iframe loading=\"lazy\" width=\"500\" height=\"281\" src=\"https:\/\/www.youtube.com\/embed\/O6MYdNLTsi0?feature=oembed\" frameborder=\"0\"><\/iframe>\n            <\/div>\n        <\/div>\n    <\/div>\n    <div class=\"c-section\">\n        <div class=\"c-text\">\n            <h2 class=\"c-title l2\">Processing Flow<\/h2>\n            <div class=\"c-image  u-text-center CARE_Processing_outer\">\n                <img src=\"https:\/\/www.j-tec.co.jp\/english\/wp-content\/uploads\/sites\/3\/2026\/02\/CARE_Processing_en.webp\" alt=\"CARE Processing Flow and Principle\" loading=\"lazy\">\n            <\/div>\n        <\/div>\n    <\/div>\n    <div class=\"c-section\">\n        \n        <div class=\"c-box\">\n          <p>\n              <strong>\u25a0Features<br> \u30fbAchieving <span style=\"color: #193286\">planarization<\/span> through atomic-scale chemical etching using metal catalyst reactions<br>\u30fb<span style=\"color: #193286\">Low environmental load processing<\/span> using only pure water, without any chemical solutions or slurry<br>\u30fbAs a final finish after polishing processes such as CMP, creating <span style=\"color: #193286\">&#8220;atomic-order surfaces&#8221;<\/span> and <span style=\"color: #193286\">&#8220;surfaces with no altered or modified layers&#8221;<\/span> in a <span style=\"color: #193286\">&#8220;clean&#8221;<\/span> manner<br> \u25a0Typical Application Examples<br>\n                  <span style=\"color: #193286\">\u30fbSurface finishing of LN substrates for SAW devices (Sa &lt; 0.1 nm)<br> \u30fbSurface finishing of wafers before bonding for bonding devices<\/span>\n              <\/strong>\n          <\/p>\n        <\/div>\n    <\/div>\n    <div class=\"c-section\">\n        <div class=\"c-text\">\n            <h2 class=\"c-title l2\">Examples of CARE-processed surfaces<\/h2>\n            <div class=\"c-image  u-text-center\">\n                <img style=\"width:800px\" src=\"\/assets\/img\/device\/care\/fig4.png\" alt=\"Examples of CARE-processed surfaces\" loading=\"lazy\">\n            <\/div>\n            <div class=\"c-box\">\n                <p class=\"u-text-center\"><strong class=\"u-fs20\">Atomically smooth and damage-free surfaces <br>High potential and applicability to semiconductor material polishing<\/strong><\/p>\n            <\/div>\n        <\/div>\n    <\/div>\n  <\/div>\n","protected":false},"excerpt":{"rendered":"<p>CAtalyst-Referenced Etching (CARE)Optimal Solution for Atomic-Level Smoothness in Next-Generation Semiconducto [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":4710,"menu_order":35,"comment_status":"closed","ping_status":"closed","template":"page-device-detail.php","meta":[],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/pages\/5230"}],"collection":[{"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/comments?post=5230"}],"version-history":[{"count":23,"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/pages\/5230\/revisions"}],"predecessor-version":[{"id":8298,"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/pages\/5230\/revisions\/8298"}],"up":[{"embeddable":true,"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/pages\/4710"}],"wp:attachment":[{"href":"https:\/\/www.j-tec.co.jp\/english\/wp-json\/wp\/v2\/media?parent=5230"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}