{"id":5230,"date":"2025-10-22T12:22:48","date_gmt":"2025-10-22T03:22:48","guid":{"rendered":"https:\/\/jteccorp.wdkb.jp\/?page_id=5230"},"modified":"2026-04-14T18:12:47","modified_gmt":"2026-04-14T09:12:47","slug":"care","status":"publish","type":"page","link":"https:\/\/www.j-tec.co.jp\/english\/device\/care\/","title":{"rendered":"CARE\uff08CAtalyst Referred Etching\uff09"},"content":{"rendered":"\n
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CARE
CAtalyst Referred Etching<\/span>\n <\/h1>\n
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CARE (CAtalyst Referred Etching) is a high-precision, atom-level machining process \n\nthat utilizes metal catalysis and relies solely on pure water, achieving a surface \n\nroughness (RMS) of less than 0.1 nm. It is typically employed as the final finishing step \n\nfollowing surface processes such as CMP (Chemical Mechanical Polishing). In SAW \n\n(Surface Acoustic Wave) devices fabricated using LN\uff08Lithium Niobate\uff09\/ LT\uff08Lithium Tantalate\uff09 wafers, CARE significantly enhances device performance. Furthermore, applying CARE to the substrates of bonded devices improves bonding reliability. This is one of our core nanomachining technologies used to realize our high-precision X-ray mirrors. <\/p>\n <\/div>\n

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Workpiece<\/dt>\n
SiO2<\/sub>, Si, LN\uff08Lithium Niobate\uff09, LT\uff08Lithium Tantalate\uff09, etc.<\/dd>\n <\/dl>\n
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Application Examples<\/dt>\n
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  • Surface finish of LN substrate for SAW devices (Sa < 0.1 nm)<\/li>\n
  • Surface finish of wafer and bonding (Si, SiO2<\/sub>, etc.) surfaces<\/li>\n
  • Improvement of junction reliability through cleanliness<\/li>\n <\/ul>\n <\/dd>\n <\/dl>\n <\/div>\n <\/div>\n
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    CA1000<\/h2>\n
    \n \"Catalyst\n <\/div>\n <\/div>\n <\/div>\n
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    Processing stage unit of the CA1000<\/h2>\n
    \n \"CARE\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n
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    Video<\/h2>\n
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