- Device Development
CARE
CAtalyst Referred Etching
CARE (CAtalyst Referred Etching) is a high-precision, atom-level machining process that utilizes metal catalysis and relies solely on pure water, achieving a surface roughness (RMS) of less than 0.1 nm. It is typically employed as the final finishing step following surface processes such as CMP (Chemical Mechanical Polishing). In SAW (Surface Acoustic Wave) devices fabricated using LN（Lithium Niobate）/ LT（Lithium Tantalate） wafers, CARE significantly enhances device performance. Furthermore, applying CARE to the substrates of bonded devices improves bonding reliability. This is one of our core nanomachining technologies used to realize our high-precision X-ray mirrors.
- Workpiece
- SiO2, Si, LN（Lithium Niobate）, LT（Lithium Tantalate）, etc.
- Application Examples
-
- Surface finish of LN substrate for SAW devices (Sa < 0.1 nm)
- Surface finish of wafer and bonding (Si, SiO2, etc.) surfaces
- Improvement of junction reliability through cleanliness
CA1000
Processing stage unit of the CA1000
Video
Processing Flow
■Features
・Achieving planarization through atomic-scale chemical etching using metal catalyst reactions
・Low environmental load processing using only pure water, without any chemical solutions or slurry
・As a final finish after polishing processes such as CMP, creating “atomic-order surfaces” and “surfaces with no altered or modified layers” in a “clean” manner
■Typical Application Examples
・Surface finishing of LN substrates for SAW devices (Sa < 0.1 nm)
・Surface finishing of wafers before bonding for bonding devices
Examples of CARE-processed surfaces
Atomically smooth and damage-free surfaces
High potential and applicability to semiconductor material polishing