Nano Fabrication Technology

EEM is a unique surface nano fabrication technology that uses chemical reactions between fine particles and the surface of the workpiece. In this method, we use special fine particles that react in ultrapure water with the surface atoms of the object. These reactions serve to remove tiny increments of the workpiece surface, leaving a surface that is ultra flat at the atomic level.

PCVM is dry etching technology using plasma at atmospheric pressure. In this process, high-frequency plasma is generated around the electrode for local generation of high-density and highly reactive radicals. Plasma and workpiece surface atoms react to form volatile substances.
PCVM is not affected by equipment accuracy due to the numerical processing control of processing volume using the plasma residence time. The atomic arrangement on the workpiece surface is not disturbed.
In addition, we aim to further improve the processing efficiency using a multi-electrode numerical control method, to develop a unique technology created at The University of Osaka, into a practical application.

High-efficiency strain-free machining is realized by chemical etching using high-density plasma

CARE processing is a unique etching technology in which a catalyst-functionalized pad—coated with materials such as Pt or Ni—is moved across the workpiece surface using ultrapure water as the processing liquid, chemically removing only the protruding areas on the surface. This enables atomic-scale smoothing of various materials, including glass and silicon.
Unlike localized CMP widely used in optical component manufacturing, CARE proceeds without any mechanical action, allowing the achievement of ultrasmooth surfaces of less than 0.1 nm RMS over the entire length of long X-ray mirrors.